Conferences

[IECON 2024] Kuan-Chieh Hsu, Jongchan Choi, and Suman Debnath, "Sparse Linear Solvers for Large-scale Electromagnetic Transient Simulations," to appear in 50th Annual Conference of the IEEE Industrial Electronics Society, (IECON) 2024 [TP]

[IEEE Micro 24] Kuan-Chieh Hsu, and Hung-Wei Tseng, "Simultaneous and Heterogenous Multithreading: Exploiting Simultaneous and Heterogeneous Parallelism in Accelerator-Rich Architectures," in IEEE Micro, vol. 44, no. 4, pp. 11-19, July-Aug. 2024 [Paper]

[MICRO 23] Kuan-Chieh Hsu, and Hung-Wei Tseng, "Simultaneous and Heterogenous Multithreading," In Proceedings of the 56th ACM/IEEE International Symposium on Microarchitecture (MICRO), 2023 [Paper][GitHub]

[DAC 23] Yu-Chia Liu, Kuan-Chieh Hsu, and Hung-Wei Tseng, "Rethinking Programming Frameworks for In-Storage Processing," In Proceedings of the 60th ACM/IEEE Design Automation Conference (DAC), 2023[Paper]

[SC 21] Kuan-Chieh Hsu and Hung-Wei Tseng, "Accelerating applications using edge tensor processing units," International Conference for High Performance Computing, Networking, Storage and Analysis (SC), 2021 [Paper][ArXiv][GitHub][Talk Download]

[ISCAS 16] Yun-Chi Huang, Kuan-Chieh Hsu, Wan-shan Hsieh, Chen-Chieh Wang, Chia-Han Lu, and Chung-Ho Chen, "Dynamic SIMD re-convergence with paired-path comparison," IEEE International Symposium on Circuits and Systems (ISCAS), 2016 [Paper]

[ICASI 15] Heng-Yi Chen, Chung-Ho Chen, Yun-Chi Huang, Kuan-Chieh Hsu, Chen-Chieh Wang, "An HSAIL ISA conformed GPU platform," Applied System Innovation - Proceedings of the International Conference on Applied System Innovation, (ICASI) 2015 [Link]

Workshops

[IAP 23] Kuan-Chieh Hsu and Hung-Wei Tseng, "Accelerating applications using edge tensor processing units," UCSD AI and Cloud Workshop (poster), IAP 2023 [Link]

[WDDSA 22] Kuan-Chieh Hsu and Hung-Wei Tseng, "Accelerating applications using edge tensor processing units," 1st Workshop on Democratizing Domain-Specific Accelerators (WDDSA), 2022 in conjunction with the 55th IEEE/ACM International Symposium on Microarchitecture [Paper]